11.Lifttheheatsinkandfanassemblyoffthefailingsystemboard.Placetheheatsinkonitssidesothatthe
thermalgreasedoesnotcomeincontactwithanything.
12.Removetheretentionmodulefromtherearofthefailingsystemboardandinstallitinthesameposition
onthenewsystemboard.
13.Toreleasethemicroprocessor2fromthesystemboardsocket,liftthesmallhandle1.
Important:Touchonlythesidesofthemicroprocessor.Donottouchthegoldcontactsonthebottom.
14.Liftthemicroprocessorstraightupandoutofthesocket.
Chapter8ReplacingFRUs(Types7061,7090,9353,9421,9485,9623,9625,9705,9786,9795,9935,9946,9953)75